引用本文
  •    [点击复制]
  •    [点击复制]
【打印本页】 【下载PDF全文】 查看/发表评论下载PDF阅读器关闭

←前一篇|后一篇→

过刊浏览    高级检索

本文已被:浏览 317次   下载 350 本文二维码信息
码上扫一扫!
基于平板热管技术的电子器件热管理研究进展
罗松1, 严昱昊1, 叶恭然1, 朱剑杰1, 欧阳洪生1,2, 肖隆湟1, 韩晓红1
0
(1.浙江大学制冷与低温研究所 浙江省制冷与低温技术重点实验室;2.含氟温室气体替代及控制处理国家重点实验室 浙江省化工研究院有限公司)
摘要:
随着电子器件不断趋于小型化和高度集成化发展,电子器件功率过高引发的散热问题亟待解决。平板热管由于具有均温性好、散热效率高等优势已为许多大功率电子元器件的散热问题提供了有效的热管理解决方案。但面对如今越来越多元化的散热需求,开发适应新型电子设备散热需求的高效平板热管仍是当前研究的热点。基于此,在对平板热管工作原理及结构特点进行阐述的基础上,对平板热管的传热性能、影响传热性能的因素(毛细芯结构、腔体厚度、工质、充液率、倾角和热源)、强化平板热管传热性能的措施(不同润湿性表面和支撑柱结构等)及其在小型化电子设备、IGBT晶体管、LED和电池组等电子器件散热应用等方面进行了系统性综述,指出研究不同毛细芯结构与腔体厚度下平板热管内部流动传热特性、散热性能强化的机制和综合优化方法,以及如何在不同电子器件热管理需求下设计出空间适应性强而散热性能高效的平板热管等仍是当前平板热管有待进一步突破的关键技术,将为平板热管在电子器件散热领域的进一步深入研究与优化提供一定参考。
关键词:  平板热管  临界热流密度  表面润湿性  强化传热  电子器件散热
DOI:
投稿时间:2023-03-08  修订日期:2023-07-05   录用日期:2023-07-31
基金项目:国家自然科学基金(52076185),浙江省自然科学基金(LZ19E060001))资助项目。
Research Progress on Thermal Management of Electronic Devices Based on Flat Heat Pipe Technology
Luo Song1, Yan Yuhao1, Ye Gongran1, Zhu Jianjie1, Ouyang Hongsheng1,2, Xiao Longhuang1, Han Xiaohong1
(1.Zhejiang Provincial Key Laboratory of Refrigeration and Cryogenic Technology, Institute of Refrigeration and Cryogenics, Zhejiang University;2.State Key Lab for Fluorine Greenhouse Gases Replacement and Control Treatment, Zhejiang Research Institute of Chemical Industry)
Abstract:
With the continued miniaturization and high integration of electronic devices, the challenge of heat dissipation caused by the excessive power consumption of electronic devices needs to be resolved urgently. An effective thermal management solution is proposed for heat dissipation in high-power electronic devices using flat heat pipes with excellent temperature uniformity and high heat dissipation efficiency. However, with the increasingly diverse heat dissipation requirements, the creation of an efficient flat heat pipe to suit the heat dissipation demands of emerging electronic equipment remains an important research topic. Therefore, based on expounding the working principle and structural characteristics of the flat heat pipes, the heat transfer performance of the flat heat pipe, the factors that affect the heat transfer performance (capillary wick structure, cavity thickness, working medium, liquid filling rate, inclination angle, and heat source), the measures to strengthen the heat transfer performance of the flat heat pipe (different wettability surfaces and support column structure, etc.), and its application in miniature electronic equipment (IGBT, LED and battery pack) are systematically reviewed. By evaluating the internal flow and heat transfer characteristics of flat heat pipes under different capillary wick structures and cavity thicknesses, the mechanism and comprehensive optimization method of heat dissipation performance, and the design of a flat heat pipe with strong space adaptability and high heat dissipation performance compatible to different electronic device heat management requirements are still key technologies to be further developed. A valuable reference is provided for further research and optimization of flat heat pipes in cooling electronic devices.
Key words:  flat heat pipe  critical heat flux  surface wettability  enhanced heat transfer  heat dissipation of electronic devices

用微信扫一扫

用微信扫一扫