| 摘要: |
| 为解决高功率裸芯片的散热问题，本文在功率模块腔体上设计了一种自循环一体化微流道散热系统，并对有无微流道、平直流道以及交联流道的散热特性进行对比。研究表明：有微流道的裸芯片散热特性优于无微流道，有交联流道的裸芯片散热特性优于具有平直流道；将裸芯片共晶焊接到金刚石热沉，再将热沉共晶焊接到功率模块腔体，裸芯片到功率模块腔体之间的传导热阻降低到传统工艺热阻的1/360~1/280；仿真与实验能够相互验证，最大偏差仅为7.16%。该微流道系统具有较强的散热能力，可解决环境温度为70 ℃，热流密度为320 W/cm2时的裸芯片散热问题。 |
| 关键词: 散热 微流道 共晶焊 金刚石 |
| DOI： |
| 投稿时间：2022-10-07 修订日期：2022-11-20
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| 基金项目: |
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| Microfluidic Cooling System in High-Power Bare Chip Modules Based on New Process Technology |
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Li Lidan, Qian Zifu, Zhang Qingjun, Liu Yajun, Li Zhi, Li Peng
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| (Sichuan Jiuzhou Electric Group Co., Ltd.) |
| Abstract: |
| A closed-loop integrated microfluidic cooling system was designed to mitigate the heat dissipation problem in a high-power bare chip. The heat dissipation capabilities of a microchannel manufactured in the cavity and an unmanufactured cavity were compared. Moreover, the heat dissipation capabilities of a straight microchannel cavity and a cross-linked microchannel cavity were compared. The results show that the heat dissipation capability of the bare chip with a microchannel cavity was better than that of the unmanufactured one, and the heat dissipation capability of the bare chip with a cross-linked microchannel cavity was better than that of a straight microchannel one. The bare chip was welded to the diamond heat sink by eutectic soldering, and the diamond heat sink was welded to the power module cavity by eutectic soldering, which reduced the thermal resistance between the power module cavity and the bare chip by a factor of 280–360 from traditional methods. Experiments and simulation calculations of the heat dissipation ability of the microfluidic cooling system were performed. The experimental and simulation results are in notable agreement, and the maximum deviation was only 7.16%. The results show that the microfluidic cooling system has a strong heat dissipation ability that can handle a 320 W/cm2 heat flux on the bare chip at 70 °C ambient temperature. |
| Key words: heat dissipation micro-channel eutectic soldering diamond |
