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| 高热流密度元器件冷却用液冷板的研究及优化 |
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战斌飞1,2,3, 徐洪波1,2, 张海南1,2, 冷冬梅1,2,3, 田长青1,2, 周远3
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| (1.中国科学院空间功热转换技术重点实验室;2.中国科学院理化技术研究所 热力过程节能技术北京市重点实验室;3.中国科学院大学) |
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| 摘要: |
| 微通道液冷板在高功率密度元器件散热上广泛使用，对于板面温度均匀性提出了更加严格的要求。本文以提升液冷板板面温度均匀性为目的，设计了一个同侧单进口、出口的全铝材质的微通道液冷板，在热流密度为300 W的情况下，测试其使用单相水和相变工质冷却的板面平均温度均匀性分别为2 ℃以内和2.6 ℃（R236fa）。为了进一步提升温度均匀性，在此基础上提出了优化流道的方案，即单进口多出口的方案，并从仿真和实验两方面验证了优化方案的有效性，实现了使用R236fa工质相变冷却后板面的温度均匀性可以控制在2 ℃以内。 |
| 关键词: 高热流密度 冷却 液冷板 温度均匀性 优化 |
| DOI： |
| 投稿时间：2020-06-17 修订日期：2020-11-21
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| 基金项目:国家重点研发计划（2018YFB0105404）和国家自然科学基金（51706232）资助项目。 |
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| Research and Optimization of Liquid Cooling Plate for High-heat-flux Components |
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Zhan Binfei1,2,3, Xu Hongbo1,2, Zhang Hainan1,2, Leng Dongmei1,2,3, Tian Changqing1,2, Zhou Yuan3
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| (1.Key Laboratory of Space Energy Conversion Technology, Chinese Academy of Sciences;2.Beijing Key Laboratory of Thermal Science and Technology, Technical Institute of Physics and Chemistry, Chinese Academy of Sciences;3.University of Chinese Academy of Sciences) |
| Abstract: |
| Fluid cooling plates are widely used in the heat dissipation of high-density components, which imposes stricter requirements for the temperature uniformity of the plate surface. In this study, to improve the temperature uniformity of the liquid-cooled plate, a liquid-cooled plate with a single inlet and single outlet was designed. Under a load of 300 W, the average temperature uniformities of the plate cooled by a single-phase water and multiple-phase-change working medium were evaluated to be within 2 ℃ and 2.6 ℃ (R236fa), respectively. To further improve the temperature uniformity, a scheme of a single inlet and multiple outlets for optimizing the flow channel was proposed. The effectiveness of the optimization scheme was verified by a simulation and experiment. The average temperature uniformity of the plate surface cooling with the R236fa working medium can be controlled to be within 2 ℃ after the optimization. |
| Key words: high heat flux cooling fluid-cooling plate temperature uniformity optimization |
