As the core equipment of communication and transmission technology

switches develop rapidly

and the heat flux emitted by internal chips increases constantly. Improving heat dissipation efficiency is a prerequisite for the reliable operation of data centers. This study focuses on the simulation and experiments of immersion liquid cooling technology. The effects of this technology were analyzed and evaluated through a liquid cooling simulation of high-power switches and heat dissipation efficiency experiments of immersion liquid cooling. The results show that the model correction method based on the heat dissipation simulation analysis of components improves the accuracy of temperature prediction. The component temperature of the switch in the immersion liquid cooling condition can be reduced by approximately 20 ℃ compared with the air-cooling environment under the same power. The power limit of the unit volume of the switch under immersion liquid cooling is approximately 3.2 times of that under air cooling environment.