Despite its small volume and quick refrigeration

semiconductor refrigeration plates have good application potential in refrigerated transportation. To examine the cooling capacity of the storage box with a semiconductor

an experimental bench was established to investigate the working performance of a storage box with two semiconductors types

namely

TEC1-12706 and TEC1-12712. The twice experiments started with 2 000 mL ice cubes and the combination with 1 500 mL ice cubes

3 kg foodstuffs

and 3 bottles of mineral water with a volume of 500 mL respectively in the storage box. Meanwhile

different heat dissipation method of the hot side and fan arrangement of the cold side were both considered during the test. The results show that the TEC1-12712 with water-cooling has a larger cooling capacity than the TEC1-12706 with air-cooling. Comparing the performance of same type of refrigeration chip using water and air-cooling

it was inferred that the water-cooling has a better cooling effect and a shorter resistance time. Moreover

a better airflow distribution appears when the fan is arranged below the cold side of the refrigeration chip rather than beside it. With the cold storage demand for a volume of 0.1 m3

two chips of the TEC1-12706 type with air-cooling on the hot side are preferred. Over 10 hours

the center temperature of the box was maintained at 6 ℃ and the minimum value in the box was approximately 0 ℃. With the freezing demand

two chips of type TEC1-12712 with water-cooling on the hot side and the fan below the cold side are preferred. With this application method

the center temperature is controlled below 0 ℃ within 3 hours.