Xu Guoliang, Duan Yang, Huang Xiaoming, et al. Influences of Non-uniform Temperature Distribution on the Performance of Hot End of a Thermoelectric Refrigerator Chip[J]. Journal of refrigeration, 2018, 39(6).
Xu Guoliang, Duan Yang, Huang Xiaoming, et al. Influences of Non-uniform Temperature Distribution on the Performance of Hot End of a Thermoelectric Refrigerator Chip[J]. Journal of refrigeration, 2018, 39(6). DOI: 10.3969/j.issn.0253-4339.2018.06.054.
Thermoelectric cooler(TEC)chips do not work in an ideal condition with uniform temperature in engineering applications due to various reasons
which leads to local high-temperature region. A non-uniform temperature distribution was applied to simulate the working condition while a 3D finite element method was used in the numerical analysis of TEC chips in the study. The influences of variations in the working temperature of the hot end(th:20~40 ℃)
maximum temperature difference (θm:5~30 ℃)
and area ratio of hot space (ω:7/16~12/16) on the performance of TEC chips were considered. The results indicate that the relative refrigerating capacity deviation reaches to -8.788%
the relative power deviation reaches to 2.608%
and the relative coefficient of performance (COP) reaches to -10.9%.