The heat dissipation of super or large computer server CPU has become the bottleneck for the development of high performance computer

therefore the cooling of super or large computer server attracted more and more attention. This paper proposes a type of radiator for cooling of computer server chip

in which heat pipe which is embedded in the radiator base plate is assembled with fin as a whole. A test bench was built

and the performance of the plate type heat pipe radiator and the proposed radiator was compared experimentally. The temperature distribution of the heat pipe body

the fin and the uniform temperature board was simulated numerically. The heat transfer in the condensing section in the proposed radiator is enhanced

so the floor area of the proposed radiator is reduced 50% compared with the plate type heat pipe radiator

and the proposed radiator has a better temperature uniformity. Under the same conditions

the average temperature of the top radiator fin is only increased 17% when the heat flux is increased from 24.3 W/cm2 to 68.6 W/cm2.