Semiconductor refrigeration

known as thermoelectric refrigeration

is applied widely in fields such as industrial production and daily life

due to the advantages of rapid cooling and easy control. The heat dissipation on the hot side is the principle element restricting the coefficient of semiconductor refrigeration. In conventional device

dehumidification is realized by condensing dehumidification method

which lowers the temperature of the cold side of semiconductor and hence restricts the system COP. The semiconductor refrigeration model with heat pipe and solid desiccant is built in this paper

and verified by the experimental results of a 6-stage semiconductor refrigeration equipment with heat pipes. Then the model is used to predict the cooling and dehumidification performances with solid desiccant. The COP of the proposed semiconductor refrigeration system is 1.78

which is much higher than that shown in literature with condensing dehumidification under the same dehumidification amount.