Study on Temperature Characteristic of Electronic Expansion Valve on Low-temperature Devices[J]. Journal of Refrigeration, 2007, 28(2): 32-35. DOI: 10.3969/j.issn.0253-4339.2007.02.007.
A low - temperature test system was set up to investigate temperature characteristic of electronic expansion valves on low - temperature devices. In the system
a thermostatic expansion valve and an electronic expansion valve were installed in parallel. The experimental results show that the temperature control curves are smooth and steady with the electronic expansion valve at the low - temperature conditions. In addition
different temperature drop rates and final balanced temperatures can be achieved by changing the open degree of the electronic expansion valve.