Improvement on the chip integration density has to face the restriction from the thermal barrier caused by the heat generation within the electronic elements. Recently

with the rapid progress of the micro/nano electronics

requirement on high performance chip cooling techniques has been further placed at a new high level. Efforts made towards this direction have led to the establishment of a series of new exciting methods. Based on analyzing the heat generation mechanisms of the electronic elements

the newly emerging chip cooling techniques and their practical applications are reviewed. Advantages and shortcomings of these methods and the relative critical issues are evaluated. Prospect in the chip cooling area is also stated.