多孔微射流热沉沸腾传热特性研究

孙健; 叶凡; 钟超; 李杰

doi:10.12465/j.issn.0253-4339.2025.05.166

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多孔微射流热沉沸腾传热特性研究

更新时间：2025-09-29

- 多孔微射流热沉沸腾传热特性研究
- Study of the Heat Transfer Characteristics of Porous Microjets Boiling in Heat Sinks
- 制冷学报 2025年46卷第5期页码：166-174
- 作者机构：
  
  景德镇陶瓷大学材料科学与工程学院　景德镇　333403
- 作者简介：
  
  孙健，男，博士，教授，景德镇陶瓷大学材料与科学学院，13507987465，E-mail：ajian933@163.com。研究方向：微尺度传热与新能源技术。
- 基金信息：
- DOI：10.12465/j.issn.0253-4339.2025.05.166
  中图分类号： TB61⁺1;TK124
- 收稿日期：2024-09-21，
  
  修回日期：2024-11-27，
  
  录用日期：2024-12-04，
  
  纸质出版日期：2025-10-16
- 稿件说明：
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孙健, 叶凡, 钟超, 等. 多孔微射流热沉沸腾传热特性研究[J]. 制冷学报, 2025,46(5):166-174.

Sun Jian, Ye Fan, Zhong Chao, et al. Study of the Heat Transfer Characteristics of Porous Microjets Boiling in Heat Sinks[J]. Journal of refrigeration, 2025, 46(5): 166-174.
孙健, 叶凡, 钟超, 等. 多孔微射流热沉沸腾传热特性研究[J]. 制冷学报, 2025,46(5):166-174. DOI： 10.12465/j.issn.0253-4339.2025.05.166.

Sun Jian, Ye Fan, Zhong Chao, et al. Study of the Heat Transfer Characteristics of Porous Microjets Boiling in Heat Sinks[J]. Journal of refrigeration, 2025, 46(5): 166-174. DOI： 10.12465/j.issn.0253-4339.2025.05.166.

摘要

随着计算机技术发展以及人工智能的应用，电子芯片越发趋向微型化、集成化，导致其单位体积发热量快速增加，从而影响正常运行。针对该问题，设计了一种阵列翅片式多孔微射流热沉，选用热稳定性和电绝缘性好的HFE-7100作为冷却工质，通过数值模拟和实验研究相结合的方法，研究槽式翅片纵宽比、入口过冷度、入口体积流量、射流雷诺数等因素对微射流沸腾传热过程影响。结果表明：优化后纵宽比为0.5的结构在满足芯片冷却要求的同时具有更好的冷却效果。单相对流传热阶段，相同工况下，入口过冷度对换热影响较小，增大体积流量或射流雷诺数可强化对流传热，最大传热系数可达15 724.40 W/（m

·K）。但在射流沸腾阶段，沸腾起始点ONB对应的热流密度随入口过冷度的减小而减小，增大入口体积流量或射流雷诺数会抑制沸腾的发生，从而削弱换热，但相对单相对流传热阶段，传热系数仍提高20.6%。

Abstract

With the development of computer technology and the application of artificial intelligence

electronic chips are becoming increasingly miniaturized and integrated

leading to a rapid increase in their volumetric heating power

thus affecting their normal operation. To address this problem

a heat sink with an array of finned porous microjets was designed

and HFE-7100

which has good thermal stability and electrical insulation

was selected as the cooling medium. Through a combination of numerical simulations and experimental research

the influence of factors such as the longitudinal aspect ratio of the slotted fins

inlet subcooling

inlet volumetric flow rate

and jet Reynolds number on the heat transfer process of microjet boiling was investigated. The results showed that the optimized structure with an aspect ratio of 0.5 met the requirements of chip cooling and had a better cooling effect. In the single-phase convection heat transfer stage

under the same working condition

the inlet subcooling degree had little effect on heat transfer

and increasing the volume flow rate or jet Reynolds number could strengthen the convection heat transfer

and the maximum heat transfer coefficient could reach 15 724.40 W/(m

·K). However

in the jet boiling stage

the heat flux corresponding to the onset of nucleate boiling (ONB)

and it decreased with a decrease in the inlet subcooling degree. Increasing the inlet volume flow rate or jet Reynolds number inhibited the occurrence of boiling

thus weakening the heat transfer. Ho

wever

compared with the single-phase convective heat transfer stage

the heat transfer coefficient increased by 20.6%.

关键词

Keywords

references

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