| 摘要: |
| 通过对一款内部具有烧结铜粉柱体作为支撑结构的均热板进行热阻分析研究，并利用商业软件Fluent对均热板进行数值分析，其热源的热流密度在5～23W/cm2间变化，当热流密度达到23W/cm2时，均热板蒸发面热源中心点处的温度接近319K，整个蒸发面的温度分布均匀。而相同条件下尺寸相同的铜板中心温度高达367K，均热板可以解决高热流密度下的散热问题，且均热板受重力影响非常微小，数值模拟和实验结果表明随热流密度升高二者误差将减小。 |
| 关键词: 工程热物理 热管 均热板 散热 数值模拟 |
| DOI： |
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| 基金项目:中科院研究生院院长基金A类（085101AM03）资助项目。 |
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| Numerical Simulation and Experimental Investigation of a Vapor Chamber |
| Jiang Yong,Li Ji |
| (Graduate University of Chinese Academy of Science) |
| Abstract: |
| An experimental investigation is carried out on a vapor chamber which is designed with some wick pillar as bracing structure. Meanwhile, CFD software Fluent is used as the the numerical simulation tool. Comparison between the numerical results and experimental results at different heat flux ranging from 5 to 23W/cm2 is studied. When the heat flux is 23W/cm2，the center temperature of vapor chamber at the evaporation side is nearly 319K，and the temperature at both evaporation and cooling sides is uniform. The comparison between the vapor chamber and copper plate with the same size at the same thermal condition shows that vapor chamber have a better thermal performance than the copper plate. The center temperature of the copper plate at the evaporation side is nearly 367K. Vapor chamber make heat-dissipation more effective at a large heat flux. The results also show gravity has little effect on vapor chamber, and the difference between numerical and experimental results decrease as the heat flux increases. |
| Key words: Engineering thermophysics Heat pipe Vapor chamber Cooling Numerical simulation |
