The high heat flux and the development of miniaturized chips have restricted the thermal diffusion ability of traditional metal materials. In this study

a vapor chamber with a micro-pin was designed and used in an integrated heat spreader (IHS). The liquid filling rate

die size

and heat sink operating parameters (water flow rate and water temperature) affect the heat transfer performance of the vapor chamber (VC) IHS compared with a Cu IHS under the same working conditions. The experimental results show that the filling rate of the VC IHS

die size

and operating parameters of the heat sink will affect the heat transfer performance. Under the conditions of high heat flux and the same working conditions

the optimal filling rate of the VC IHS was 90%. The thermal resistance decreased with an increase in the heat sink parameters and die size. When the heat flux was 200 W/cm2

the VC IHS had a shorter start-up time and better temperature uniformity. Its thermal resistance and junction temperature are both lower than those of a Cu IHS

and the thermal resistance is reduced by 20%. In the field of high heat flux and miniaturized chip packaging

the VC has better application prospects in terms of efficient heat dissipation and temperature uniformity. The corresponding relationship between the thermal resistance ratio and the heat flux under different area ratios provides references for the chip packaging VC IHS thermal design.