For a domestic processor motherboard of an embedded computer

the heat dissipation technology of aluminous vapor chamber is adopted. Structure design

simulation analysis

and test research are carried out. An equivalent replacement for simulation analysis method for vapor chamber is proposed. The heat dissipation performance of the whole machine using aluminous vapor chamber at 65 ℃ is simulated

and the heat dissipation performance of the aluminous vapor chamber in its actual engineering prototype was tested by experiments. The test results show that the maximum error of the equivalent replacement for simulation results of vapor chamber is 4.8% compared with test results

and the simulation error of the junction temperature of domestic processors is 1% at a high temperature of 65 ℃. The maximum temperature difference at room temperature and a 65℃-high temperature environment in the vapor chamber is 4.7 ℃ and 5.6 ℃

respectively. The maximum junction temperature of the domestic processor is 100 ℃

which is lower than the allowable junction temperature of 105 ℃. It is concluded that the equivalent replacement simulation analysis method has high accuracy and can effectively predict the heat dissipation performance of vapor chamber. The aluminous vapor chamber can meet the heat dissipation requirements of the domestic processor board

which is present in fully sealed embedded computers.