| 摘要: |
| 设计了一种新型多芯片平板热管散热器，通过测试模拟芯片的表面温度，对散热器在不同空气流速、芯片数目及位置和加热功率下的散热性能进行了实验研究。测试结果表明：在环境温度为20℃、芯片表面温度控制在80℃的条件下，散热器水平使用时，单芯片、双芯片和三芯片的最大散热能力分别为310W，390W和500W；散热器竖直使用时，其最大散热能力分别为275W，408W，500W。由此得出，多芯片平板热管散热器的散热性能较单芯片散热器具有更大优势。实验结论与平板热管的热扩散效果吻合良好，而且符合现代电子器件散热的要求。 |
| 关键词: 热工学 平板热管 多芯片冷却 电子器件 散热器 |
| DOI： |
| 投稿时间：2012-01-13
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| 基金项目: |
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| Experimental Investigation of the Thermal Performance of Flat Heat Pipe Heat Sink for Multi-chip Cooling |
| Han Xiaoxing,Tian Zhifeng,He Wenxiu,Wang Yaxiong |
| (School of Chemistry and Chemical Engineering, Inner Mongolia University of Science and Technology) |
| Abstract: |
| A novel plat heat pipe heat sink for multi-chip was designed, and the thermal performance of the heat sink in different air speed, chips numbers and positions, heating power was experimentally investigated. The experimental results showed that the maximum heat transport capacity of the heat sink with one, two and three heat sources were 310W, 390 W and 500 W respectively in the horizontal position, and 275W, 408W, 500W in the vertical application when the chips temperature was less than 80℃ and the ambient temperature was 20℃. For the flat heat pipe heat sink, multiple chips cooling can dissipate more heat than unique source. The results were found to agree well with the experimental data about the thermal spreading effect of the flat heat pipe. It was shown that flat heat pipe accords with the requirements of electronic devices cooling. |
| Key words: pyrology flat heat pipe multiple chips cooling electronic devices heat sink |
