| 摘要: |
| 芯片集成度的提高,要受到因电子元器件发热而引起的热障所限制.近年来,随着微/纳电子技术的飞速发展,更使得对高性能冷却技术的需求提到了前所未有的层面.对此的全力追求,促成了一系列激动人心的新型冷却方法的建立.本文在讨论电子元器件产热机制的基础上,对新近涌现出的若干典型芯片冷却技术及其应用情况进行了综合分析,讨论了其优缺点及有待解决的关键问题,并对这一领域的发展前景作了一定展望. |
| 关键词: 热工学 芯片冷却技术 综述 芯片封装 强化换热 气冷 液冷 固体制冷 |
| DOI： |
| 修订日期：2004-02-02
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| 基金项目: |
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| Latest Research Advancement and Assessment of Chip Cooling Techniques |
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| Abstract: |
| Improvement on the chip integration density has to face the restriction from the thermal barrier caused by the heat generation within the electronic elements. Recently, with the rapid progress of the micro/nano electronics, requirement on high performance chip cooling techniques has been further placed at a new high level. Efforts made towards this direction have led to the establishment of a series of new exciting methods. Based on analyzing the heat generation mechanisms of the electronic elements, the newly emerging chip cooling techniques and their practical applications are reviewed. Advantages and shortcomings of these methods and the relative critical issues are evaluated. Prospect in the chip cooling area is also stated. |
| Key words: Pyrology,chip cooling technique,review,chip package,enhanced heat transfer,gas cooling,liquid cooling,solid refrigeration |
