In response to the power increase in electronic devices with high heat flux density

new efficient cooling technologies should be developed to ensure the safe operation of these electronic devices. The application of micro-pin-fin structures under high-degree subcooled boiling is a promising way of enhancing the cooling capacity. In this study

subcooled boiling on a micro pin-fin surface was observed

and the effects of the subcooled temperature on the heat transfer coefficient and critical heat flux were measured. Moreover

the heat transfer coefficients of the micro-pin-fin structure were compared with those of a smooth surface

and the heat transfer enhancement mechanism of the micro-pin-fin structure was investigated. The results show that the heat transfer coefficient of the micro-pin-fin surface increases with an increase in the subcooled degree when the heat flux is greater than 200 W/cm2.The critical heat flux increases from 228 W/cm2 to more than 400 W/cm2 when the subcooled degree increases from 50 ℃ to 95 ℃. The heat transfer coefficient of the micro-pin-fin surface is always larger than that of the smooth surface under the same working conditions

and the effect of the micro-pin-fin surface is more obvious under high degrees of subcooling and high heat flux. The enhancement factor is 1.28 when the heat flux is 250 W/cm2 and the degree of subcooling is 95 ℃.