With the continued miniaturization and high integration of electronic devices

the challenge of heat dissipation caused by the excessive power consumption of electronic devices needs to be resolved urgently. An effective thermal management solution is proposed for heat dissipation in high-power electronic devices using flat heat pipes with excellent temperature uniformity and high heat dissipation efficiency. However

with the increasingly diverse heat dissipation requirements

the creation of an efficient flat heat pipe to suit the heat dissipation demands of emerging electronic equipment remains an important research topic. Therefore

based on expounding the working principle and structural characteristics of the flat heat pipes

the heat transfer performance of the flat heat pipe

the factors that affect the heat transfer performance (capillary wick structure

cavity thickness

working medium

liquid filling rate

inclination angle

and heat source)

the measures to strengthen the heat transfer performance of the flat heat pipe (different wettability surfaces and support column structure

etc.)

and its application in miniature electronic equipment (IGBT

LED and battery pack) are systematically reviewed. By evaluating the internal flow and heat transfer characteristics of flat heat pipes under different capillary wick structures and cavity thicknesses

the mechanism and comprehensive optimization method of heat dissipation performance

and the design of a flat heat pipe with strong space adaptability and high heat dissipation performance compatible to different electronic device heat management requirements are still key technologies to be further developed. A valuable reference is provided for further research and optimization of flat heat pipes in cooling electronic devices.