To address the problem of high-efficient heat dissipation in the insulated gate bipolar transistor (IGBT) modules used in high-speed trains

a pin-fin heat sink was designed and applied to dry ice particle spray cooling. Three sets of different pin-fin parameter models are established

and the influence of the pin-fin number

diameter

and height on the heat dissipation effect is analyzed by numerical simulation. The optimal pin-fin heat sink has 64 pin-fins

a diameter of 12 mm

and a height of 45 mm. Compared with the baseline heat sink without fins

the surface temperature of the heat transfer substrate is reduced by 10.57 °C

and the sublimation rate of dry ice inside the radiator is increased by 17.2%. The flow state of the dry ice particle cooling fluid in the pipeline and the disturbance and collision processes of the dry ice particles inside the heat sink are observed experimentally

and the simulation results are verified. The dry ice particle spray cooling keeps the IGBT module with a heat source power of 1.6 kW at approximately 25 °C to meet its heat dissipation requirements. Therefore

it is necessary to provide guidance for in-depth research on dry ice particle spray cooling technology.