To meet the needs of efficient electronics cooling

a flat loop heat pipe (LHP) with novel evaporator structure was designed based on improving capillary pressure

decreasing flow resistance

enhancing heat transfer and reducing heat leakage. Compared with evaporator of conventional flat loop heat pipe

the novel evaporator replaced mechanical microchannels with biporous microchannels. Heat transfer performance of the LHP was investigated at the anti-gravity orientation. The experimental result showed that

the LHP can start-up quickly without any temperature overshoot and oscillation at the heat load of 20 W. Besides

the novel LHP was able to keep the highest temperature of the evaporator below 80℃

and the thermal resistance of LHP was only 0.15 K/W at the heat load of 200 W. The comparative experiments indicated that the novel design of evaporator can shorten the heat transfer route in the height direction

enhance evaporation/boiling heat transfer and further reduce heat leakage

thus improved the anti-gravity operating ability of LHP.