| 摘要: |
| 为了解决智能手机使用的大功率芯片中非均匀分布热点的散热问题，本文采用手机芯片作为热源，利用软件使手机满载工作以模拟实际的高温场景，采用具有各向异性导热系数的导热层和用于小型散热系统的热沉以提高热电制冷器的制冷效率，在此基础上建立了制冷效率可控的热管理系统。此外，为了减少热电制冷器热端的热量积累，还设计了一种周期性电源控制器。结果表明：热管理系统将芯片温度从48 ℃降至34 ℃，提高了约20%的满载芯片利用率，有效提升了手机流畅度，为解决非均匀分布热点的散热问题提供了指导。 |
| 关键词: 热电制冷器 芯片 热管理系统 导热系数 |
| DOI： |
| Received:November 20, 2021Revised:January 04, 2022 |
| 基金项目:国家自然科学基金（61704006），北京新星项目多学科合作项目(Z191100001119013)，北京市教委科研计划项目（KM202111232015），北京信息科技大学师资补充扶持项目（2019-2021）（5029011103）资助。 |
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| Design of Thermoelectric Cooling System for Heat Removal from Non-uniform Distributed Heat Source in Cell Phones |
|
Zhang Jinyang, Cao Lili, Miao Min
|
| (Key Laboratory of the Ministry of Education for Optoelectronic Measurement Technology and Instrument, School of Information and Communication Engineering, Beijing Information Science & Technology University) |
| Abstract: |
| In this study, the problem of heat dissipation of non-uniformly distributed hot spots in high-power chips used in cell phones was investigated. A cell phone chip was used as a heat source, and software was used to accelerate the operation speed and monitor the frequency usage rate that replicates the realistic operating condition. A thermally conductive layer with anisotropic thermal conductivity and a heat sink for a cooling system was designed to increase the cooling efficiency of the thermoelectric cooler. A thermal management system based on the simulation results was built with a variable cooling efficiency. Furthermore, for long-term stability, a periodic power supply controller was designed to reduce heat accumulation on the hot side of the thermoelectric cooler and reduce power consumption. As a result, chip temperature was reduced from 48 to 34 ℃, and the utilization of a full load chip was improved by approximately 20%, whichserves as a solution to the problem of cooling heat sources with non-uniform distribution. |
| Key words: thermoelectric cooler chip thermal management system thermal conductivity |
