摘要: |
在工程应用中,热电制冷(TEC)芯片由于多种原因可能无法在理想均温工况工作,即出现局部高温的情况。本文通过设定的非均匀温度分布来模拟热端散热不良工况,应用三维有限元分析方法对其工作性能进行数值模拟研究。从不同热端工作温度(th:20~40 ℃)、高温区最高过余温度(θm:5~30 ℃)、高温区面积常数(ω:7/16~12/16)等方面分析了不同工况下TEC芯片的工作性能,结果表明:相对制冷量偏差达到-8.788%,相对功率偏差达到2.608%,相对COP偏差达到-10.9%。 |
关键词: 热电制冷芯片 制冷量 COP 散热不均 有限元分析 |
DOI: |
Received:October 18, 2017 |
基金项目:国家自然科学基金(No.51576077)资助项目。 |
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Influences of Non-uniform Temperature Distribution on the Performance of Hot End of a Thermoelectric Refrigerator Chip |
Xu Guoliang1, Duan Yang1, Huang Xiaoming1, Chen Xintao2
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(1.School of Energy and Power Engineering, Huazhong University of Science and Technology;2.Zhangjiagang Core Electric Appliance Co., Ltd.) |
Abstract: |
Thermoelectric cooler(TEC)chips do not work in an ideal condition with uniform temperature in engineering applications due to various reasons, which leads to local high-temperature region. A non-uniform temperature distribution was applied to simulate the working condition while a 3D finite element method was used in the numerical analysis of TEC chips in the study. The influences of variations in the working temperature of the hot end(th:20~40 ℃), maximum temperature difference (θm:5~30 ℃), and area ratio of hot space (ω:7/16~12/16) on the performance of TEC chips were considered. The results indicate that the relative refrigerating capacity deviation reaches to -8.788%, the relative power deviation reaches to 2.608%, and the relative coefficient of performance (COP) reaches to -10.9%. |
Key words: thermoelectric refrigerator chip refrigerating capacity COP non-uniform heat dissipation finite element analysis |