| 摘要: |
| 微通道技术是芯片冷却最具前景的技术之一。本文采用数值模拟的方法对比分析了不同孔隙率 (e=0.2~0.8、e-rise和e-drop) 多孔鳍歧管微通道流动传热特性。结果表明：多孔鳍可以显著降低歧管微通道流动阻力，最高超过20%。但随着入口速度增加，压降降低效果逐渐减弱。在研究的孔隙率变化范围内，e=0.4和e=0.6的多孔鳍歧管微通道综合性能更好。基于芯片最高温度评价，e-rise案例相比e=0.4案例热阻更低，压降更高；且随着入口速度增加，热阻优势得到强化，压降劣势逐渐缩小。与e=0.4案例相比，e-rise案例在压降仅高1.4%的情况下，热阻降低8%。 |
| 关键词: 电子设备冷却 歧管微通道 多孔介质 孔隙率 流动传热 |
| DOI： |
| 投稿时间：2021-10-20 修订日期：2021-12-02
|
| 基金项目:国家自然科学基金（U20A20300），山东省自然科学基金（ZR2019MEE024）和深圳市自然科学基金项目（JCYJ20190807092801669）资助。 |
|
| Flow and Heat Transfer Characteristics in Manifold Microchannel with Porous Fins |
|
Chen Chaowei1, Wang Xinyu2, Xin Gongming1
|
| (1.School of Energy and Power Engineering，Shandong University;2.Institute of Thermal Science and Technology，Shandong University) |
| Abstract: |
| Microchannel technology is one of the most promising technologies for chip cooling. In this study, the flow and heat transfer characteristics in manifold microchannels with different porosities (e=0.2-0.8, e-rise, and e-drop) of porous fins and solid fins were compared and analyzed using numerical simulation. The results showed that porous fins considerably reduced the flow resistance in the manifold microchannel by more than 20%. However, the pressure drop reduction effect decreased at larger inlet velocity. In the studied porosity variation range, the porous fins with e=0.4 and e=0.6 exhibited a better comprehensive performance. Based on the evaluation of the maximum chip temperature, e-rise had a lower thermal resistance and higher pressure drop than e=0.4. As the inlet velocity increased, the thermal resistance advantage of the porous fins with e-rise was strengthened, and its pressure drop gradually reduced. Compared to the e=0.4 case, there was an 8% reduction in thermal resistance in the e-rise case, at the cost of only a 1.4% increase in pressure drop. |
| Key words: electronics cooling manifold microchannel porous medium porosity flow and heat transfer |
