In this study

the problem of heat dissipation of non-uniformly distributed hot spots in high-power chips used in cell phones was investigated. A cell phone chip was used as a heat source

and software was used to accelerate the operation speed and monitor the frequency usage rate that replicates the realistic operating condition. A thermally conductive layer with anisotropic thermal conductivity and a heat sink for a cooling system was designed to increase the cooling efficiency of the thermoelectric cooler. A thermal management system based on the simulation results was built with a variable cooling efficiency. Furthermore

for long-term stability

a periodic power supply controller was designed to reduce heat accumulation on the hot side of the thermoelectric cooler and reduce power consumption. As a result

chip temperature was reduced from 48 to 34 ℃

and the utilization of a full load chip was improved by approximately 20%

whichserves as a solution to the problem of cooling heat sources with non-uniform distribution.