Microchannel technology is one of the most promising technologies for chip cooling. In this study

the flow and heat transfer characteristics in manifold microchannels with different porosities (e=0.2-0.8

e-rise

and e-drop) of porous fins and solid fins were compared and analyzed using numerical simulation. The results showed that porous fins considerably reduced the flow resistance in the manifold microchannel by more than 20%. However

the pressure drop reduction effect decreased at larger inlet velocity. In the studied porosity variation range

the porous fins with e=0.4 and e=0.6 exhibited a better comprehensive performance. Based on the evaluation of the maximum chip temperature

e-rise had a lower thermal resistance and higher pressure drop than e=0.4. As the inlet velocity increased

the thermal resistance advantage of the porous fins with e-rise was strengthened

and its pressure drop gradually reduced. Compared to the e=0.4 case

there was an 8% reduction in thermal resistance in the e-rise case

at the cost of only a 1.4% increase in pressure drop.