In the environmental test of precision electronic components

the uniformity and fluctuation of temperature field in the environmental test chamber are very important to the test result. To develop an environmental test chamber with high performance

sevarel chamber structure models were proposed first from the view point of temperature field and velocity field on the basis of traditional clockwise and counterclockwise box structures. Then

the temperature field with different air flow patterns were simulated

in which different angle

position and velocity of supply air are included and considered. Finally

the simulation results were verified based on a test chamber prototype with return air in the center. The results showed that the average temperature and temperature standard deviation were similar for the three cases: 0°angle of supply air with clockwise structure

return air at the center position with counterclockwise structure

and multiple outlets. There was still a gap between the experimental and simulation data regarding the standard deviation of temperature uniformity. The average temperature and temperature standard deviation of all measuring points was ?71.55 ℃ and ?1.55 ℃. The maximum temperature deviation of all measuring points was 1.8 ℃. However

after the data were decentralized

the temperature at each point had a similar distribution.