How to enhance the heat dissipation performance of water-cooled radiator to maintain the normal operating temperature of computer chips become the research focus of data center server cooling. In this paper

the comprehensive coefficient F and chip temperature of water-cooled radiator are taken as the target parameters. The orthogonal test method is used to optimize the thickness of the radiator's substrate

the location of the channel (located on the substrate)

the number of channels and the width of the channel. The optimal combination of F index and F index radiator is obtained according to different needs. The results showed that the maximum heat flux of the T and F index radiators was 78 and 65 W/cm2

respectively

under a cooling water volume flow rate of 0.4 L/min and an inlet temperature of 20 ℃. The heat dissipation performance was analyzed from two aspects

i.e.

temperature distribution of the radiator basement and the total thermal resistance. It showed that the temperature gradient and total thermal resistance of the T index radiator were lower than that of the F index radiator

indicating that the T index radiator is superior to the F index radiator. However

the pressure drop of the F index radiator was lower than that of the T index radiator under different flow rates. When the chip heat flux was less than 65W/cm2

the flow performance of fluids in the channel of F index radiator was better and could meet the heat dissipation requirements of the data center server. Moreover

the higher heat flux should be cooled by the T index radiator.