Experimental Study on Performance of Semiconductor Cooling Device for Communication Cabinet Cooling

Yang Wansheng; Chen Shilin; Bi Yin

doi:10.3969/j.issn.0253-4339.2017.05.082

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Experimental Study on Performance of Semiconductor Cooling Device for Communication Cabinet Cooling

更新时间：2024-07-18

- Experimental Study on Performance of Semiconductor Cooling Device for Communication Cabinet Cooling
- Journal of Refrigeration Vol. 38, Issue 5, (2017)
- 作者机构：
  
  广东工业大学土木与交通工程学院
- 作者简介：
- 基金信息：
- DOI：10.3969/j.issn.0253-4339.2017.05.082
  CLC：
- Published：2017
- 稿件说明：
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Yang Wansheng, Chen Shilin, Bi Yin. Experimental Study on Performance of Semiconductor Cooling Device for Communication Cabinet Cooling[J]. Journal of refrigeration, 2017, 38(5).
DOI：

Yang Wansheng, Chen Shilin, Bi Yin. Experimental Study on Performance of Semiconductor Cooling Device for Communication Cabinet Cooling[J]. Journal of refrigeration, 2017, 38(5). DOI： 10.3969/j.issn.0253-4339.2017.05.082.

摘要

本文设计了一种可用于通信机柜的半导体冷却装置，搭建了测试平台测试分析了制冷量及制冷效率。根据测试结果对该半导体冷却装置在空气冷却工况下的制冷量、制冷效率及影响因素进行了分析，得到性能评价参数。结果表明：当环境平均温度为26 ℃且输入功率在200~360 W范围内时，装置的制冷效率先增大后减小，在输入功率为232 W时制冷效率达到最大值69.5%，期间制冷小室平均制冷量为455.45 kJ，而半导体冷却装置的冷却功率为151.8 W，且在相同条件下该装置可以带走5 kW通信机柜3.04%的热量。

Abstract

In this study

a cabinet semiconductor cooling device was designed and its refrigerating capacity and cooling efficiency were tested using a test platform. The performance parameters were obtained according to test-based analyses of the refrigerating capacity

cooling efficiency

and other factors. According to the test results

for an average indoor temperature of 26 ℃ and 200-360 W input power

the cooling efficiency first increases and then decreases

reaching a maximum value of 69.5% when the input power is 232 W. Meanwhile

the average amount of refrigeration throughout the test is 455.46 kJ and the power of the semiconductor cooling device is 151.8 W

which can remove 3.04% of the energy in a 5 kW communication cabinet.

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