Wu Jian, Liu Yuan, Li Yanxiang, et al. Study on Heat Transfer Enhancement of Lotus-type Porous Copper Heat Sink[J]. Journal of refrigeration, 2016, 37(3).
DOI:
Wu Jian, Liu Yuan, Li Yanxiang, et al. Study on Heat Transfer Enhancement of Lotus-type Porous Copper Heat Sink[J]. Journal of refrigeration, 2016, 37(3). DOI: 10.3969/j.issn.0253-4339.2016.03.094.
Study on Heat Transfer Enhancement of Lotus-type Porous Copper Heat Sink
Lotus-type porous copper is a new kind of micro-channel structure with long cylindrical pores aligned in one direction. It can be used as a heat sink for cooling of high-power electronic components. Through experiments and numerical simulations with Flow Simulation
the heat transfer performance of a lotus-type porous copper heat sink with uniform distributed micro-groove was systematically studied. The experimental results showed that this kind of heat sink has an excellent heat transfer coefficient
as high as 10.1 W/(cm2?K)
only under a flow rate as low as 110 mL/s. The simulation showed that optimal number and angle of micro-groove existed for the heat sink to reach a maximal equivalent heat transfer coefficient. For water as its coolant
the optimal number and angle of micro-groove were 7-11 and 45°
respectively. And heat transfer performance of the heat sink continuously improved with decreasing of the width of micro-groove. The numerical simulation results were compared with the experimental results
and the reasons for the differences were analyzed.