A novel plat heat pipe heat sink for multi-chip was designed

and the thermal performance of the heat sink in different air speed

chips numbers and positions

heating power was experimentally investigated. The experimental results showed that the maximum heat transport capacity of the heat sink with one

two and three heat sources were 310W

390 W and 500 W respectively in the horizontal position

and 275W

408W

500W in the vertical application when the chips temperature was less than 80℃ and the ambient temperature was 20℃. For the flat heat pipe heat sink

multiple chips cooling can dissipate more heat than unique source. The results were found to agree well with the experimental data about the thermal spreading effect of the flat heat pipe. It was shown that flat heat pipe accords with the requirements of electronic devices cooling.