Study on Temperature Characteristic of Electronic Expansion Valve on Low-temperature Devices[J]. Journal of Refrigeration, 2007, 28(2): 32-35.
DOI:
Study on Temperature Characteristic of Electronic Expansion Valve on Low-temperature Devices[J]. Journal of Refrigeration, 2007, 28(2): 32-35. DOI: 10.3969/j.issn.0253-4339.2007.02.007.
Study on Temperature Characteristic of Electronic Expansion Valve on Low-temperature Devices
A low - temperature test system was set up to investigate temperature characteristic of electronic expansion valves on low - temperature devices. In the system
a thermostatic expansion valve and an electronic expansion valve were installed in parallel. The experimental results show that the temperature control curves are smooth and steady with the electronic expansion valve at the low - temperature conditions. In addition
different temperature drop rates and final balanced temperatures can be achieved by changing the open degree of the electronic expansion valve.
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Related Author
Jin Lulu
Sheng Jian
Zhang Hua
Liu Yantao
Zhu Tianjie
Zhan Feilong
Zhou Shaohua
Ding Guoliang
Related Institution
Shanghai Key Laboratory of Multiphase Flow and Heat Transfer in Power Engineering, School of Energy and Power Engineering, University of Shanghai for Science and Technology
GD Midea Refrigeration Equipment Co., Ltd.
School of Mechanical Engineering, Shanghai Jiao Tong University
Institute of Refrigeration and Cryogenics, University of Shanghai for Science and Technology