Research Status of Microchannel Heat Dissipation Technology Based on Porous Structure

Zhou Xiong; Zhang Li

doi:10.12465/j.issn.0253-4339.2025.02.017

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Research Status of Microchannel Heat Dissipation Technology Based on Porous Structure

更新时间：2025-04-15

- Research Status of Microchannel Heat Dissipation Technology Based on Porous Structure
- Journal of Refrigeration Vol. 46, Issue 2, Pages: 17-27(2025)
- 作者机构：
  
  华东理工大学机械与动力工程学院　上海　 200237
- 作者简介：
  
  Zhang Li, female, professor, doctoral supervisor, School of Mechanical and Power Engineering, East China University of Science and Technology, 86-21-64252847, E-mail: lzhang@ecust.edu.cn. Research fields: enhanced heat transfer technology and equipment.
- 基金信息：
  
  National Natural Science Foundation of China(51776074)
- DOI：10.12465/j.issn.0253-4339.2025.02.017
  CLC： TB61⁺1;TB657.5;TK124
- Received：17 November 2023，
  
  Revised：29 January 2024，
  
  Accepted：2024-02-19，
  
  Published：16 April 2025
- 稿件说明：
移动端阅览
Zhou Xiong, Zhang Li. Research Status of Microchannel Heat Dissipation Technology Based on Porous Structure[J]. Journal of refrigeration, 2025, 46(2): 17-27.
DOI：

Zhou Xiong, Zhang Li. Research Status of Microchannel Heat Dissipation Technology Based on Porous Structure[J]. Journal of refrigeration, 2025, 46(2): 17-27. DOI： 10.12465/j.issn.0253-4339.2025.02.017.

摘要

随着微电子器件的飞速发展，电子设备越来越倾向于小型轻量化、高集成度、高热流密度的方向发展。多孔结构因其能有效拓展传热面积、增加汽化核心和调控壁面润湿性而强化沸腾传热，广泛应用于散热领域。基于多孔结构的微通道散热技术是提高散热器性能十分有效且极具发展前景的方法。微通道表面多孔结构、微通道内填充多孔材料和微通道骨架为多孔结构是近年来3种常见的多孔结构和微通道相结合增强沸腾传热的结构形式，多孔结构主要包括多孔涂层、微腔、金属泡沫、多孔翅片和多孔肋等。主要对近年来基于多孔结构的微通道散热技术的研究进展进行了综述，对比分析了上述3种强化传热结构的优缺点，阐述了微通道散热器在传热性能和压降的平衡设计方面所面临的问题，并提出了相关的优化设计方法。

Abstract

The rapid development of microelectronic devices has driven a trend toward miniaturized and lightweight electronic devices with high heat flux. Porous structures are increasingly used in heat dissipation due to their ability to expand the heat transfer area

enhance nucleation sites for boiling

and regulate surface wettability

significantly improving boiling heat transfer. Microchannel heat dissipation technology based on porous structures has emerged as an effective and promising method to enhance heat sink performance. Recent advancements highlight three common configurations: porous structures on microchannel surfaces

porous materials within microchannels

and porous microchannel skeletons. These structures encompass coatings

microcavities

metal foams

porous fins

and ribs. This article reviews progress in microchannel heat dissipation using porous structures

evaluates the benefits and drawbacks of these configurations

addresses challenges such as balancing heat transfer and pressure drop

and proposes optimization strategies to overcome these issues.

关键词

Keywords

references

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