Numerical Study on the Enhancement of Flow and Heat Transfer Characteristics by Electrodes at the Bottom of Microchannels

Xu Shaoqin; Zhang Xilong; Liu Jiaxin

doi:10.12465/issn.0253-4339.20251208001

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Numerical Study on the Enhancement of Flow and Heat Transfer Characteristics by Electrodes at the Bottom of Microchannels

更新时间：2026-07-08

- Numerical Study on the Enhancement of Flow and Heat Transfer Characteristics by Electrodes at the Bottom of Microchannels
- Journal of Refrigeration Pages: 1-11(2026)
- 作者机构：
  
  1.青岛理工大学机械与汽车工程学院青岛 266520
  2. 再制造技术国家级重点实验室北京 100072
- 作者简介：
  
  Zhang Xilong， Male， Professor School of Mechanical and Automotive Engineering， Qingdao University of Technology +8618681955545 Email： zhangxilong@qut.edu.cn. Research Interests： Cooling of chips and high-power electronic devices， new energy power system technologies， heat pump air conditioning technologies for new energy vehicles， heat and mass transfer characteristics of nanof
- 基金信息：
- DOI：10.12465/issn.0253-4339.20251208001
  CLC： TK124;TB61⁺1
- Revised：2025-12-25，
  
  Accepted：14 January 2026，
  
  Online First：07 July 2026，
- 稿件说明：
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徐绍钦，张西龙，刘佳鑫. 微通道底部电极增强流动与传热特性的数值研究［J］. 制冷学报，XXXX，XX（XX）：1-11.

Xu Shaoqin，Zhang Xilong，Liu Jiaxin. Numerical Study on the Enhancement of Flow and Heat Transfer Characteristics by Electrodes at the Bottom of Microchannels［J］. Journal of Refrigeration，XXXX，XX（XX）：1-11.
徐绍钦，张西龙，刘佳鑫. 微通道底部电极增强流动与传热特性的数值研究［J］. 制冷学报，XXXX，XX（XX）：1-11. DOI： 10.12465/issn.0253-4339.20251208001.

Xu Shaoqin，Zhang Xilong，Liu Jiaxin. Numerical Study on the Enhancement of Flow and Heat Transfer Characteristics by Electrodes at the Bottom of Microchannels［J］. Journal of Refrigeration，XXXX，XX（XX）：1-11. DOI： 10.12465/issn.0253-4339.20251208001.

摘要

随着微电子器件功率密度持续升高，散热已成为制约性能的瓶颈。虽然矩形微通道换热面积大，但纯压力驱动下流动以层流为主，热边界层限制了性能提升。。本文基于三维数值模型，研究了不同电极构型对流场及温度分布的影响，提出了正电极周期递增排布方式，对深入阐明电场对流体的作用机制具有重要意义。研究表明：正电极周期递增排布能够在通道底部附近有效诱发出一种周期性的“伪粗糙度”涡结构。这些涡旋通过强烈扰动黏性与热边界层，使近壁局部速度梯度显著增大，从而同时强化了对流传热、提升了整体流速并改善了减阻特性。在边界层流速方面，与常规光滑通道相比，采用周期性递增排布（结构1）的增强幅度最高，达41.6%；均匀排布（结构2）次之，为36.8%；周期性递减排布（结构3）相对较低，为32%。这一趋势同样体现在综合性能上：周期递增排布与均匀排布的综合性能评价指标（performance evaluation criterion）值分别提升了90%和70%。尤其是，在相同的施加电压和散热性能条件下，采用周期递增排布可使压降大幅降低66.7%，表现出明显优于其他两种构型的综合性能。

Abstract

Following the continuous increase in power density of microelectronic devices， heat dissipation has become a critical bottleneck limiting performance. Although rectangular microchannels offer a large heat transfer area， the flow under purely pressure-driven conditions remains predominantly laminar， and the thermal boundary layer limits further enhancement. In this study， a three-dimensional numerical model was employed to investigate the effects of different electrode configurations on flow field and temperature distribution. A positive electrode arrangement with periodically increasing spacing was proposed， providing the essential insights into the mechanism by which the electric field interacts with the fluid. The results reveal that this periodically increasing arrangement effectively induces periodic vortex structures， referred to as "pseudo-roughness，" near channel bottom. These vortices strongly disturb the viscous and thermal boundary layers， significantly increasing the local near-wall velocity gradient， thereby simultaneously enhancing the convective heat transfer， increasing the overall flow velocity， and improving drag reduction. In terms of the boundary layer velocity， relative to a conventional smooth channel， the periodically increasing arrangement （Structure 1） achieved the highest enhancement of 41.6%， followed by the uniform arrangement （Structure 2） at 36.8%， and the periodically decreasing arrangement （Structure 3） at 32%. This trend was also reflected in the overall performance： the periodically increasing and uniform arrangements improved the performance evaluation criterion （PCE） by 90% and 70%， respectively. Notably， under the identical applied voltage and heat dissipation performance condition， the periodically increasing arrangement reduced the pressure drop by 66.7%， demonstrating a markedly superior overall performance compared with the other two configurations.

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