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西安工程大学城市规划与市政工程学院 西安 710048
Received:03 November 2025,
Revised:2025-11-10,
Accepted:11 November 2025,
Published:16 February 2026
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高远,黄翔,冯世豪等.智算中心蒸发冷却风液协同冷却系统构建与实验验证[J].制冷学报,2026,47(01):96-104.
Gao Yuan Huang Xiang Feng Shihao Chu Junjie.Development and Experimental Validation of an Integrated Evaporative and Hybrid Air-Liquid Cooling System for Intelligent Computing Centers[J].Journal of Refrigeration,2026,47(01):96-104.
高远,黄翔,冯世豪等.智算中心蒸发冷却风液协同冷却系统构建与实验验证[J].制冷学报,2026,47(01):96-104. DOI: 10.12465/issn.0253-4339.20251103001. CSTR: XXXXX.XX.XXX.20251103001.
Gao Yuan Huang Xiang Feng Shihao Chu Junjie.Development and Experimental Validation of an Integrated Evaporative and Hybrid Air-Liquid Cooling System for Intelligent Computing Centers[J].Journal of Refrigeration,2026,47(01):96-104. DOI: 10.12465/issn.0253-4339.20251103001. CSTR: XXXXX.XX.XXX.20251103001.
针对智算中心高功率密度散热难题,本文提出一种风液同源液冷系统。该系统通过统一冷源协同供冷,采用“先风冷、后液冷”的梯级水流设计,以降低㶲损失并实现冷量的品位匹配。研究通过CFD模拟优化了冷源机组流道,并实验测试了其在高温高湿、中温中湿及低温3种工况下的性能。结果表明:优化机组在高温工况下出水温度低至32.17 ℃,COP最高达28.03;中温工况下可实现完全自然冷却;低温工况下COP峰值达33.4,且运行稳定。系统整体逼近度为0.1~1.8 ℃,冷却能力达105.3%,性能优于国标。本研究为高密度智算中心提供了一种高效可行的冷却解决方案。
To address the heat dissipation challenges associated with high power density in intelligent computing centers, this study proposes an air-liquid dual source cooling system. The system utilizes a unified cold source with a stepwise water flow sequence of "air-cooling first, liquid-cooling second" to reduce exergy loss and match the temperature-grade of the respective cold source. The internal flow channel of the cooling unit was optimized through computational fluid dynamics simulations, and its performance was experimentally tested under high-temperature with high-humidity, moderate-temperature with moderate-humidity, and low-temperature conditions. Results indicate that the optimized unit achieves an outlet water temperature as low as 32.17 ℃ with a maximum coefficient of performance (COP) of 28.03 under high-temperature conditions. The unit also enables complete natural cooling under moderate conditions and reaches a peak COP of 33.4 under low-temperature conditions while maintaining stable operation. The system's overall approach degree ranges from 0.1 ℃ to 1.8 ℃, and its cooling capacity reaches 105.3%, outperforming the national standard. This study provides an efficient and practical cooling solution for high-density intelligent computing centers.
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