| 摘要: |
| 本文针对某嵌入式计算机中的国产处理器主板采用铝基均热板散热技术，开展了均热板的结构设计、仿真分析与实验测试研究。提出一种均热板等效替代仿真分析方法，仿真分析了高温65 ℃下采用铝基均热板的整机散热性能，并对实际工程样机中铝基均热板的散热性能进行了实验测试。测试结果表明：高温65 ℃环境下，均热板等效替代仿真分析结果相对实验测试结果的最大误差为4.8%，国产处理器结温的仿真误差为1%；常温下均热板上最大温差为4.7 ℃；高温65 ℃环境下均热板上最大温差为5.6 ℃，国产处理器最大结温100 ℃，低于允许结温105 ℃。由此得出，等效替代仿真分析方法准确性较高，能有效预估均热板散热性能，铝基均热板可以满足全密封嵌入式计算机中国产处理器主板的散热需求。 |
| 关键词: 均热板 热仿真 热测试 嵌入式计算机 国产处理器 |
| DOI： |
| 投稿时间：2019-03-24 修订日期：2019-06-15
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| 基金项目: |
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| Design, Simulation and Experimental Study of Aluminous Vapor Chamber Based on a Motherboard |
| Kang Mingkui,Wang Xiaoming,Li Haitao,Guo Kai |
| (The No. 771 Institute, China Aerospace Science and Technology Corporation;AVIC Taiyuan Aero-Instruments Co., Ltd.) |
| Abstract: |
| For a domestic processor motherboard of an embedded computer, the heat dissipation technology of aluminous vapor chamber is adopted. Structure design, simulation analysis, and test research are carried out. An equivalent replacement for simulation analysis method for vapor chamber is proposed. The heat dissipation performance of the whole machine using aluminous vapor chamber at 65 ℃ is simulated, and the heat dissipation performance of the aluminous vapor chamber in its actual engineering prototype was tested by experiments. The test results show that the maximum error of the equivalent replacement for simulation results of vapor chamber is 4.8% compared with test results, and the simulation error of the junction temperature of domestic processors is 1% at a high temperature of 65 ℃. The maximum temperature difference at room temperature and a 65℃-high temperature environment in the vapor chamber is 4.7 ℃ and 5.6 ℃, respectively. The maximum junction temperature of the domestic processor is 100 ℃, which is lower than the allowable junction temperature of 105 ℃. It is concluded that the equivalent replacement simulation analysis method has high accuracy and can effectively predict the heat dissipation performance of vapor chamber. The aluminous vapor chamber can meet the heat dissipation requirements of the domestic processor board, which is present in fully sealed embedded computers. |
| Key words: vapor chamber thermal simulation thermal test embedded computer domestic processor |
